Mold 2.0 High Speed Linker Released: Moves From AGPL To MIT License

www.phoronix.com

cross-posted to:
technology@lemmy.ml

Mold 2.0 High Speed Linker Released: Moves From AGPL To MIT License

www.phoronix.com

seasonone@opidea.xyz to

Technology@beehaw.org · 1 year ago

cross-posted to:
technology@lemmy.ml

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