The Apple MacBook Neo’s $599 starting price is a “shock” to the Windows PC industry, according to an Asus executive.
Hsu said he believes all the PC players—including Microsoft, Intel, and AMD—take the MacBook Neo threat seriously. “In fact, in the entire PC ecosystem, there have been a lot of discussions about how to compete with this product,” he added, given that rumors about the MacBook Neo have been making the rounds for at least a year.
Despite the competitive threat, Hsu argued that the MacBook Neo could have limited appeal. He pointed to the laptop’s 8GB of “unified memory,” or what amounts to its RAM, and how customers can’t upgrade it.
Am I the only one even a little happy to see the head of a major company mentioning upgradability as an appeal for customers?
Please do stick with two unsoldered SODIMM slots for your laptops Asus.
I don’t know what Asus is doing as I haven’t owned one, but some manufacturers are finally starting to do LPCAMM2. Which near me is actually cheaper than SODIMMs. And is technically superior. One reason (besides being able to sell you a new device when memory goes bad) that manufacturers solder RAM it is that it allows for faster speeds than SODIMMs, at lower power requirements.
Really?!
The only laptop I was with LPCAMM was a specific Lenovo laptop that used LPCAMM to connect to a SODIMM daughter board.
Are there others you know of?
Thinkpad P1 Gen 7 and the upcoming T14 Gen 7. The latter got 10/10 in repairability from iFixit, and the T lineup has always been great at longevity, repairability, and drive-over-it-with-a-tractor-or-pour-water-on-the-keyboard-survivability. I’m suspecting most upcoming Thinkpads will have it. Some Thinkbooks do as well, but I don’t trust any Lenovo without a Thinkpad name on it, and not even all of those.
Dell Pro Max lineup as well.
They’re only just starting to come out. Within the next few years I imagine most manufacturers will have offerings with LPCAMM.
That may be the case, but the most irritating thing is that thy fill all available spots with the lowest-capacity chips that meet the requested provisioning spec, instead of taking the requested provisioning and using the fewest higher-capacity chips needed to meet the provisioning spec. The latter, at least, would leave spots open for an authorized repair location to manually solder on more approved chips of compatible spec.