Alphane Moon@lemmy.worldM to

Hardware@lemmy.worldEnglish · 4 days ago

LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

29

LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

Alphane Moon@lemmy.worldM to

Hardware@lemmy.worldEnglish · 4 days ago

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.

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SwizzleStick@lemmy.zip
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4 days ago
Let’s see how well they drop test…
- a_person@lemdro.id
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  Or bend test lol (iphone 15)

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