LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
Again, it’s about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.
“LG proposes eliminating solder balls”
“By instead using copper, with solder balls on top”
What?
The article is utter garbage and misunderstands dimensions.
The new strategy allows for pads to be closer together not for the whole thing to be flatter. It allows to shrink sideways, not in height.
My phone is thinner sideways than most, and it’s often a problem when browsing websites that make assumptions about screen dimensions.
Again, it’s about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.